Ampron安培龙

About

Leading Chinese multi-sensor platform company spanning temperature, pressure, oxygen, and force/torque sensors. Originally a thermistor maker, now expanding aggressively into humanoid robot force sensors including 6-axis F/T sensors.

Shenzhen, Guangdong · Founded 1999 · Company website

Why in the Index

Specialty sensor maker (pressure, temperature, force). Force-torque sensing for industrial and humanoid robots.

PAI exposure of 60% reflects the share of trailing-twelve-month revenue attributed to Physical AI activities. See methodology §4 for inclusion criteria and §6 for how PAI exposure scales the weight.

Key Physical AI activities

• Ntc/ptc Thermistors & Temperature Sensors · Temperature sensor · 1999Core legacy product line covering home appliances, automotive, and energy storage applications. 48.3% of 2024 revenue.
• Pressure Sensors (Glass Micro-fused & MEMS) · Pressure sensor · 2011Full-range coverage (low/mid/high) using proprietary glass micro-fused and MEMS technology. 49.8% of 2024 revenue.
• Oxygen Sensors · Oxygen sensor · 2011Sensor cores and complete oxygen/NOx sensors for automotive emissions and IoT applications.
• Torque Sensors (1D) · Force/torque sensor · 202550-1500Nm range using MEMS silicon strain gauge + glass micro-fused technology or metal foil strain gauge. For humanoid robot hip/knee joints, collaborative and industrial robots.
• Six-axis Force/torque Sensor · Force/torque sensor · 2025Dual technology path: metal strain gauge (completed development H1 2025) and MEMS silicon strain gauge + glass micro-fused (in R&D). For humanoid robot joint modules and end effectors.
• Push/pull Force Sensors · Force sensor · 2025Completed engineering validation. Sent samples to multiple domestic robot companies.

Key partnerships

• Tianji Intelligence (天机智能)
• BYD
• SAIC
• Midea
• Gree
• Haier
• Magna
• Li Auto
• XPeng
• NIO

Milestones

• 1999—Founded as Ampron Sensitive (安培龙敏感), focused on PTC thermistors
• 2004—Co-founders Wu Ruojun, Li Xuejing, Li Li established Amperlong (安培盛)
• 2015—Reorganized as Shenzhen Ampron Technology Co., Ltd.
• 2023—IPO on Shenzhen Stock Exchange ChiNext board (301413.SZ)
• 2024—Revenue reached ¥940M ($130M), 25.9% YoY growth
• 2024—Established Shanghai subsidiary for robot force sensor R&D and Belgium subsidiary for European R&D talent
• 2024—Built glass micro-fused pressure sensor production line, achieving full low/mid/high range coverage
• 2025—Strategic partnership with Tianji Intelligence for MEMS-based force sensors for robot joint modules
• 2025-05—Obtained TISAX AL2 certification for automotive information security, enabling European OEM market entry
• 2025-H1—Metal strain gauge 6-axis F/T sensor completed full development cycle (design, prototyping, testing, process verification)
• 2026—Planned ¥540M secondary offering for pressure sensor expansion, force sensor production line (500K units/year), and MEMS sensor chip R&D

Competitive position

Multi-sensor platform play: ceramics + MEMS + IC design vertical integration. Revenue ¥940M (2024) with 21.8% CAGR (2019-2024). Market cap ~¥12.3B. Core advantage is leveraging existing ceramic materials + MEMS expertise from temperature/pressure sensors into force/torque sensors for humanoid robots. Dual tech path for 6-axis F/T: metal strain gauge (ready) + MEMS silicon (in development with Tianji Intelligence). Key clients span appliances (Midea, Gree, Haier), automotive (BYD, Li Auto, XPeng, NIO, Magna), and energy (CATL). Planning 500K units/year force sensor line. Currently in sample testing phase with multiple domestic robot companies.

Recent activity